Cool Reads by TCLAD
Welcome to TCLAD’s digital library. Please check back here often for the latest on our advanced thermal management materials and technologies.
TCLAD SPL-15 Viable Solution to Replace DBC
Dec 2025
TCLAD’s SPL-15 delivers 10 W/m·K dielectric thermal conductivity and a 270°C glass transition temperature, putting it squarely in DBC territory for power module thermal performance, without the fragility. At 30 GPa Young’s modulus versus 250–370 GPa for conventional DBC ceramics, SPL-15 absorbs CTE mismatch stress that cracks ceramic substrates over thousands of thermal cycles. For SiC IGBT modules, high-power LEDs, and laser modules, that means equivalent thermal performance, dramatically lower long-term failure risk, and a cost-effective, RoHS-compliant process path.
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Thermal and Reliability Optimization of IMS Substrates for Power Modules
Nov 2025
A joint study by National Sun Yat-sen University, ASE Group, and North Carolina State University, with TCLAD support, delivers the FEA and experimental data power module designers need to justify IMS over silicon nitride AMB ceramic substrates. An asymmetric IMS structure with an optimized top copper thickness achieves near-equivalent thermal resistance to Si₃N₄ AMB, at tenfold lower warpage and with robust dielectric insulation strength intact. For engineers weighing IMS against ceramic on cost, reliability, and thermal performance, this paper provides the head-to-head numbers to close the argument.
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Hot Spots & Cool Tricks: Taming Heat in High-Power PCBs
June 2025
TCLAD’s SFL-12 dielectric runs at 3.2 W/m·K more than 10 times the thermal conductivity of standard FR4. In controlled head-to-head testing at Rochester Institute of Technology, using FLIR thermal imaging on identical six-layer stackups under the same power load, SFL-12 boards ran up to 27°C cooler than their FR4 counterparts. Add TCLAD Surface Mount Thermal Bridge (SMTB) components and the margin widens further. This paper documents the test methodology, board construction, and initial results, the performance case for SFL-12 as a drop-in FR4 replacement for high-power PCB applications.
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Dielectric Materials for IMS® Applications Provide Durable Thermal Management Solutions for High-Power Electronics
June 2025
TCLAD dielectric materials offer many advantages in power conversion applications. Their excellent insulation properties allow them to withstand high voltages and electric fields without breaking down. In addition, they are resistant to moisture, contaminants and temperature fluctuations.
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Insulated Metal Substrate (IMS®) with Embedded Thermal Pyrolytic Graphite (TPG) for Wide-Bandgap Semiconductor Power Modules
February 2024
Next-generation power electronics demand innovative technologies. While wide-bandgap semiconductors are capable of superior performance under extreme conditions, this ability is useless without advancements in the substrates upon which these devices are mounted.
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TCLAD Application Spotlight: Advanced Heat Dissipation Solutions for EV Applications
August 2021
TCLAD’s Insulated Metal Substrates (IMS®) are key components in powertrain inverters and DC-DC power conversion systems. We work closely with our customers during the design phase to tailor thermal management solutions for their specific high power-density applications — helping them meet the strict safety, durability, and efficiency requirements of today’s demanding EV platforms.
TCLAD Application Spotlight: Solutions for Industrial Motion Control
July 2021
TCLAD’s Thermal Clad Insulated Metal Substrates (IMS®) support industrial motion control systems. Design engineers are taking advantage of TCLAD’s high-reliability solution for use in critical industrial applications. We work closely with our customers to set new levels of motion-control performance, connectivity, and flexibility.
TCLAD Inc. U.S. Mfg & Global
Innovation Center
1600 Orrin Rd, Prescott
WI 54021 USA
Phone: +1 715 262 5898
Email: sales.us@tclad.com
TCLAD Europe GmbH
Amelia-Mary-Earhart-Str. 8, 60549
Frankfurt am Main, Germany
Phone: +886 3 5635598
Email: sales.eu@tclad.com
TCLAD Technology Corp.
1 F., No. 5, Gongye E. 7th Rd.,
East Dist., Hsinchu City 300093,
Taiwan (R.O.C)
Phone: +886 3 5635598
Email: sales.asia@tclad.com