TCLAD Thermal Interface Materials (TIMs)

TCLAD offers a comprehensive portfolio of high-performance thermal interface materials engineered to efficiently transfer heat between electronic components and heat sinks or enclosures. Our lineup includes Thermal Pads, Gap Fillers, Greases, Gels, Phase Change Materials, Thermally Conductive Inks, and more — each are RoHS compliant and designed to improve heat dissipation in high-power electronic assemblies.

Thermally Conductive Filler Pads

TCLAD Thermally Conductive Filler Pads (TCFPs) are soft, highly conformable, materials designed to absorb shock and vibration while effectively filling air gaps between uneven surfaces. Formulated with a silicone base and thermally conductive fillers, these pads deliver excellent thermal conductivity. Available in sheets or custom-cut shapes and a variety of thicknesses, our TCFP materials provide versatile and reliable solutions for diverse thermal management applications.

Thermally Conductive Filler Liquids

TCLAD Thermally Conductive Filler Liquids (TCFLs) are two-part liquid systems that are mixed prior to application. Once blended, the material is pressure-dispensed to eliminate air gaps, then cured into a solid form for long-term performance. In their liquid state, TCFLs are compatible with both automated and manual dispensing systems, conform easily to complex surface topographies, and provide excellent surface wetting. The TCFL-RW option is a reworkable formulation, allowing it to be easily peeled off after curing.

Thermally Conductive Grease Series

TCLAD’s Thermally Conductive Grease Series(TCGS) delivers excellent heat dissipation, minimal bondline thickness, and superior wet-out performance. Designed to provide low interfacial resistance and extremely low thermal impedance, these greases are ideal for high power density applications, where a thin bondline is essential for optimal thermal conductivity. TCGS require no curing and are compatible with both automated dispensing and screen-printing processes.

Phase Change Materials

TCLAD’s Phase Change Materials (PCMs & HCAs) absorb and release thermal energy as they transition from a solid to a wax-like state, offering a cleaner, easier-to-handle alternative to thermal greases. They are simple to apply — just remove the liner from one side, place the material onto the target surface, peel off the second liner, and press the mating surface together.

Heat Conductive Adhesives (HCAs) are a type of PCMs with built-in adhesive strength, enabling both efficient heat transfer and component bonding without additional adhesive layers.

Thermally Conductive Gel Liquids

TCLAD Thermally Conductive Gel Liquids (TCGLs) are engineered for low-stress thermal management and offer easy rework and process flexibility. Ideal for assemblies with delicate components, these one-component, conformable gels are compatible with both automated and manual dispensing systems.

Thermal Potting Materials

TCLAD Thermal Potting Materials (TPMs) are two-part systems that, that once mixed and dispensed, function as both filler and encapsulant — protecting sensitive electronics from environment factors such as dust and moisture. Formulated to efficiently conduct heat away from components like power-transistors to a heat sink or heat spreader, they deliver excellent thermal dissipation while enhancing mechanical integrity.

Thermal Insulation Pads

TCLAD Thermal Insulation Pads (TIPs) are highly flexible, silicone-based materials designed to improve heat transfer while providing effective electrical isolation and toughness. Typically clamped between heat generating components and a heatsink, TIPs help protect temperature-sensitive components by minimizing thermal resistance. These pads are ideal for power semiconductor applications where dielectric strength is important for withstanding high voltage.

Thermal Set Pads

TCLAD Thermal Set Pads (TSPs & TSPF-H) are thermally conductive, electrically isolating materials that cure with heat to form strong, adhesive bonds. TSPs are epoxy-based while TSPF-H products are based on fluorine resin. Both types use high performance thermally conductive fillers. These thin materials are available in rolls, sheets or custom-cut shapes with adhesive on both sides for positioning between components to improve heat transfer. Packaging option includes bulk, trays and reels to suit a range of production needs.

Thermally Conductive Inks

TCLAD Thermally Conductive Inks (TCIs) are epoxy-based resins in liquid form that combine excellent thermal conductivity and reliable electrical isolation. These inks are ideal for tight spaces and complex part geometries and are compatible with dispensing, stencil printing and spray-on thin coating processes for multiple, versatile, applications.