Multi-Layer Circuit Stacks with Thermal Clad Dielectrics

Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards. By vertically stacking copper foils with glass-fiber-reinforced dielectric layers, we create complex circuit structures that deliver superior thermal conductivity, electrical isolation, and mechanical strength. When paired with a copper base plate, blind vias can be implemented to create conductive pathways between circuit layers and the base – boosting thermal conduction and electrical performance.

Ideal for high-power and high-frequency RF applications that demand low dielectric constant and minimal loss tangent, this cost-effective additive buildup process serves as a drop-in replacement for standard FR4. It delivers substantial thermal performance improvements without the need for costly redesign. 

High-Performance Liquid Cooled IMS®

Our Liquid Cooled IMS® solutions offer a highly efficient method of reducing thermal resistance and enhancing overall cooling performance. These advanced designs integrate liquid cooling with a pin-fin or metal-foam cold plate and an IMS® PCB to maximize heat transfer to the cooling fluid. They are compatible with water cooling and can be further enhanced using TCLAD’s proprietary liquid dielectric cooling fluid, delivering superior thermal performance for the industry’s most demanding applications.