Thermal Clad Dielectrics
Strategically Engineered & Patented
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats – from insulated metal substrate (IMS®), to prepreg (PP) composites, and rigid copper-clad (RCC) laminates.
High-Performance Dielectrics by TCLAD
Engineered for High-Power IMS®/MCPCB Applications
Flagship Thermal Clad Dielectric Solutions
Our proprietary dielectrics are engineered to deliver exceptional electrical isolation and ultra-low thermal impedance. Available in a variety of formulations and thicknesses to suit diverse application requirements, these advanced materials enhance performance and reliability where thermal management and electrical insulation are critical.
Contact us for a full list of Thermal Clad products and thicknesses.
| Thermal Clad Products | Thickness | Thermal Conductivity (W/m-K) | Thermal Resistance (°C-in2/W) | Breakdown Voltage (KVAC) | Glass Transition Tg (°C) | CTE in XY/Z <Tg (µm/m°C) | CTE in XY/Z >Tg (µm/m°C) | Technical Data Sheet |
|---|---|---|---|---|---|---|---|---|
| SFL-3E | 4.0 mil (100µm) | 1.6 | <0.13 | 7 | 55 | 24 | 32 | Download |
| SFL-2A | 4.0 mil (100µm) | 1.65 | <0.13 | 6 | 130 | 20 | 30 | Download |
| SFL-3 | 4.0 mil (100µm) | 1.7 | <0.12 | 6 | 140 | 25 | 32 | Download |
| HT | 3.0 mil (76µm) | 2.2 | 0.05 | 8.5 | 150 | 25 | 95 | Download |
| 4.0 mil (100µm) | 2.2 | 0.077 | 9.3 | 150 | 25 | 95 | Download | |
| 6.0 mil (152µm) | 2.2 | 0.11 | 11 | 150 | 25 | 95 | Download | |
| 9.0 mil (225µm) | 2.2 | 0.16 | 20 | 150 | 25 | 95 | Download | |
| SFL-4 | 4.0 mil (100µm) | 2.5 | 0.11 | 5 | 150 | 16 | 25 | Download |
| SFL-8 | 4.0 mil (100µm) | 2.75 | 0.08 | 5 | 150 | 28 | 35 | Download |
| HPL | 1.5 mil (38µm) | 3.0 | 0.02 | 5 | 185 | 35 | 85 | Download |
| 2.0 mil (50µm) | 3.0 | 0.026 | 7.7 | 185 | 35 | 85 | Download | |
| 4.0 mil (100µm) | 3.0 | 0.031 | 12.2 | 185 | 35 | 85 | Download | |
| 6.0 mil (152µm) | 3.0 | 0.039 | 17.4 | 185 | 35 | 85 | Download | |
| SFL-12 | 4.0 mil (100µm) | 3.2 | 0.06 | 5 | 180 | 15 | 18 | Download |
| SPL-15 | 4.0 mil (100µm) | 10 | <0.015 | 4 | 270 | 11.7 | 24.3 | Download |
| SFLG-8 | 4.0 mil (100µm) | 1.85 | 0.09 | 5 | 150 | 28 | 35 | Download |
| SFLG-12 | 4.0 mil (100µm) | 2.8 | 0.065 | 5 | 180 | 15 | 18 | Download |
Selecting Dielectric Materials
Property values provide valuable insights; however, real-world thermal performance is application dependent. Let our team of experts help you navigate the options and select the ideal dielectric material for your application’s unique power, isolation, and temperature requirements.
Key Benefits of Thermal Clad Dielectrics
- Low z-axis expansion for stability under thermal cycling
- Supports thin stack-up designs for compact assemblies
- Solvent-free, low-VOC options for sustainable manufacturing
- High electrical insulation and breakdown strength
- Lead-free process compatibility
- Durable and reliable for long-term performance
- Semi-flexible bond layer absorbs stress and strain
- Built for extreme automotive, military, and aerospace conditions
TCLAD Inc. U.S. Mfg & Global
Innovation Center
1600 Orrin Rd, Prescott
WI 54021 USA
Phone: +1 715 262 5898
Email: sales.us@tclad.com
TCLAD Europe GmbH
Amelia-Mary-Earhart-Str. 8, 60549
Frankfurt am Main, Germany
Phone: +886 3 5635598
Email: sales.eu@tclad.com
TCLAD Technology Corp.
1 F., No. 5, Gongye E. 7th Rd.,
East Dist., Hsinchu City 300093,
Taiwan (R.O.C)
Phone: +886 3 5635598
Email: sales.asia@tclad.com