TCLAD IMS® Technology

Advanced Thermal Management with a Purpose

TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges. Engineered for high-performance, our IMS®/Thermal Clad Metal Core PCBs (MCPCBs) dramatically reduce thermal impedance and improve heat conduction – enabling more effective and efficient heat transfer compared to traditional FR4 PCBs. Beyond enhancing thermal performance, TCLAD IMS® products offer outstanding mechanical strength, making them significantly more durable than conventional FR4 PCBs.

Anatomy of a TCLAD IMS® PCB

Standard IMS® construction consists of:

• Circuit Layers: Etched copper circuitry, with typical thicknesses ranging from 0.5 oz. to 10 oz. (17 – 360 µm). Although most designs incorporate 2 to 4 circuit layers, we have the advanced capability to fabricate IMS® boards with higher layer counts.
• Dielectric Layers: Provide excellent electrical insulation and outstanding thermal conductivity. Our patented dielectrics are formulated with polymer and ceramic. The dielectric layer also serves to bond the base metal and circuit layers together.
• Base Layer: Typically made of aluminum or copper, with thicknesses tailored to meet specific application demands. This layer functions as a heat sink or heat spreader, playing a critical role in TCLAD IMS® thermal management.

Thermal Clad Materials for IMS®/Metal Core PCBs (MCPCBs)

TCLAD offers a broad portfolio of IMS® dielectric materials available for direct purchase. We can also collaborate with you to custom-configure solutions that meet your specific requirements. From design concept and rapid prototyping to final production, we support every stage of development to ensure peak performance and manufacturability.