Capabilities

At TCLAD, we design and manufacture printed circuit boards (PCBs) for high-power, mission-critical applications. Our expertise lies in Insulated Metal Substrate® and advanced thermally conductive, electrically isolating dielectric materials, engineered with integrated heat dissipation capacity for superior thermal performance. Additionally, our thermal interface materials (TIMs), surface-mountable thermal bridges and circuit protection solutions further enhance system performance and reliability.

What Sets Us Apart

High-Performance Materials

TCLAD’s advanced thermal management solutions are built on high-performance materials engineered to deliver exceptional thermal conductivity, robust electrical insulation, and mechanical strength. Perfectly suited for power-dense electronic systems, these materials not only dissipate heat with precision but also reinforce structural integrity and optimize electrical performance.

Material Highlights:

  • 5052 Aluminum – Standard thicknesses, versatile, cost-effective, and corrosion resistant
  • 6061-T6 Aluminum – Standard thicknesses, high strength, and excellent machinability
  • Copper – Standard & custom thicknesses, maximum conductivity
  • Dielectric Laminates – Reliable electrical isolation with efficient heat transfer
  • Liquid Dielectric Immersion Cooling Fluids– Tailored for the most demanding applications
  • Thermal Pyrolytic Graphite (TPG) – Ultra-high thermal conductivity for extreme heat dissipation

Surface Finishes

The right surface finish can make all the difference. Whether you’re aiming to boost corrosion resistance, improve solderability, or enhance thermal and electrical conductivity, selecting the appropriate finish is key to meeting both performance goals and environmental requirements.

Finish Options:

  • Aluminum Base Finishes:
    • Brushed – For consistent texture and improved bonding
    • Anodized – Increases surface hardness and corrosion resistance
    • Iridite (Chromate Conversion Coating) – Offers good conductivity with corrosion protection, RoHS- compliant variants available
  • Copper Base Finishes:
    • Brushed – Reduces oxidation and prepares the surface for secondary coatings
    • Nickel Plating – Improves corrosion resistance, solderability, and surface hardness
    • Tin Plating – Cost-effective solution for excellent solderability and oxidation resistance
  • Soldermask Options:
    • Standard Green – Industry standard for PCB protection and visibility
    • Custom Colors – Black, white, red, and blue available for branding or design differentiation
    • Matte, Gloss & Transparent Finishes – For aesthetic or optical clarity preferences

Circuitry

TCLAD IMS® (Insulated Metal Substrate) PCBs are engineered for high-performance applications where thermal control and current-carrying capacity are critical. These boards deliver up to 40% greater current carrying capacity than traditional FR4 designs – often allowing for thinner copper layers without sacrificing performance. Our advanced fabrication capabilities accommodate a wide range of copper foil thicknesses, fine line geometries, complex via patterns, and tightly controlled tolerances.

Key Circuit Parameters:

  • Copper Circuit Foil – IMS® boards typically support a 40% higher current-carrying capacity compared to FR4. often enabling reduced copper foil thickness while maintaining performance.
  • Solder Pad Finishes – Standard options include HASL and Pb-free HASL. Advanced finishes such as ENIG, Silver (Ag), Nickel-Palladium-Gold (NiPdAu), and OSP are also available for enhanced performance, reliability and solderability.
  • Circuit-to-Edge Clearance:
    • Aluminum Base – Minimum is one material thickness + 0.5mm (0.020”)
    • Copper base – Minimum is two material thicknesses
  • Circuit-to-Hole Clearance – Minimum is one material thickness + 0.5mm (0.020”)
  • Line Widths – Capable of supporting fine lines from 0.13mm (0.005”) to 0.38mm (0.015”), depending on copper foil thickness.

Drilling & Blanking

TCLAD’s versatile drilling and blanking capabilities accommodate a wide range of board shapes and design specifications. Whether you’re working with simple layouts or intricate geometries, our board fabrication processes deliver accuracy, consistency, and manufacturing efficiency to meet your project’s demands.

Fabrication Parameters:

  • Hole Formation – Holes can be precision drilled or punched, with typical edge-to-hole positional tolerance of +/- 0.25mm (0.010”).
  • Minimum Hole Diameter – Typically equal to one material thickness, ensuring structural integrity and manufacturability.
  • Perimeter Blanking – Ideal for complex board outlines with tight dimensional control.
  • Board Shapes & Separation – Square or rectangular boards maximize efficient material utilization. V-Scoring is ideal for prototyping boards with straight edges — allowing easy separation without tooling investment.
  • Corner Radii – Standard minimum radius is equals one material thickness.

Multi-Layer Construction

TCLAD designs and manufactures advanced multi-layer PCBs specifically engineered to tackle the thermal challenges of high-density and high-power electronic systems. By vertically stacking copper foils with glass-fiber-reinforced dielectric layers, we create complex circuit structures that deliver superior thermal conductivity, electrical isolation and mechanical strength.

Thermal and Electrical Performance Parameters:

  • Efficient Heat Management – TCLAD’s dielectric laminating films offer significantly lower thermal impedance than FR4, often eliminating the need for thermal vias. For designs requiring additional thermal performance, vias can still be strategically included to further boost heat dissipation.
  • Enhanced Connectivity with Copper Base Plates – When a copper base plate is used as a dedicated ground plane, blind vias can be implemented to create conductive pathways between circuit layers and the base plate — optimizing both thermal conduction and electrical performance.

Customization

At TCLAD, we understand that no two applications are alike. That’s why we offer a broad array of customization options — from specialized material selections and multi-layer stackups to precision engineered mechanical features and integrated liquid cooling. Our expert engineering and manufacturing teams work closely with  you to ensure your performance goals and design specifications are fully realized.

Key Customization Options:

  • Ultra-Thin Circuits – For applications where space is at a premium and thermal mass is not a critical factor, TCLAD dielectrics can be used without the metal base plate to create ultra-thin circuits. These configurations are ideal for component-level packaging and can achieve total thickness as low as 0.23mm (0.009”), even in double-sided constructions.
  • Hybrid Integrations for Enhanced Performance – TCLAD designs and manufactures hybrid thermal management solutions that significantly boost thermal conductivity while increasing mechanical strength and system reliability — a smart solution for designs that need a boost of structural integrity and heat dissipation.
  • Quick-Turn Prototyping – Accelerate project timelines with TCLAD’s fast, reliable prototype manufacturing services.

Testing

At TCLAD, we validate performance, integrity, and safety of every PCB we produce. Our comprehensive testing and inspection protocols ensure your circuits meet the highest standards for quality and reliability.

Testing Capabilities:

  • Detection of Opens & Shorts – Automatic Optical Inspection (AOI) systems to compare the etched panel against original Gerber data.
  • Dielectric Withstand (HiPot) Testing – This critical safety test assesses a circuit’s insulation strength by applying a high voltage to ensure it can endure electrical stress without breakdown.
  • Dynamic Mechanical Analysis (DMA) – DMA equipment measures the modulus of materials over a range of temperatures
  • Thermal Bias Age Testing – Chamber ovens take materials to temperatures above Tg. At selected intervals, samples are removed and tested for integrity.
  • Thermogravimetric Analyzer (TGA) – Measures the stability of our dielectrics at high temperatures, baking the materials at prescribed temperatures and measuring weight loss.

TCLAD Inc. U.S. Mfg & Global
Innovation Center
1600 Orrin Rd, Prescott
WI 54021 USA
Phone: +1 715 262 5898
Email: sales.us@tclad.com

TCLAD Europe GmbH
Amelia-Mary-Earhart-Str. 8, 60549
Frankfurt am Main, Germany
Phone: +886 3 5635598
Email: sales.eu@tclad.com
 

TCLAD Technology Corp.
1 F., No. 5, Gongye E. 7th Rd.,
East Dist., Hsinchu City 300093,
Taiwan (R.O.C)
Phone: +886 3 5635598
Email: sales.asia@tclad.com